Let’s Learn About MAXKGO ALL-IN-ONE BMS

The second highlight of MKBMS is: heat dissipation.
The material of MSXKGO integrated board BMS is multi-layer glass fiber board with high Tg (the higher the Tg value, the better the temperature resistance of the board). Without shall version, it mainly relies on the flow of air to dissipate heat.
Compared with the bare board, the BMS with a shell uses an aluminum alloy shell, which not only brings better heat dissipation effect, but also forms a very good protective effect on the circuit board: it can isolate dust and other impurities, and prolong the life of the board and electronic components. Long life, custom aluminum housing also makes the BMS more beautiful.

Even users who have purchased bare boards do not need to worry about heat dissipation.
Our all-in-one 12S 200A bare board, the main overcurrent heat dissipation is through copper strips.

Our all-in-one BMS bare board can still carry a large current in such a small size without the heat dissipation assistance of thermally conductive adhesive and aluminum alloy shell, mainly for the following reasons:
1. The PCB board of our integrated board uses a high Tg multi-layer glass fiber board (the higher the Tg value, the better the temperature resistance of the board), and the 200A board uses a multi-layer combined glass fiber board.
2. The board layout has 4 copper strips on both sides. The size of the copper strip is 66*10*2 mm, and the material is red copper. The overcurrent and heat dissipation of the BMS pass through the copper strips. The purpose of designing these four copper strips is to provide greater stability for the overcurrent and heat dissipation.

3. Our all-in-one board BMS uses high-quality MOSFETs, although MOSFETs themselves do not have the function of heat dissipation. But high-quality MOSFETs can maintain a low temperature during overcurrent.
The above points all ensure that our BMS has stable characteristics during overcurrent. Even if thermal conductive glue and metal casing are not required, the flow of air can also conduct good heat dissipation.

Technical advantages:
MKBMS-SS is based on the modular BMS of LTC6811 and STM32 MCUs.

• The LTC6811 is a multi-cell battery pack monitor that measures up to 12 cells in series with less than 1.2mV total measurement error.
• STM32MCU is a 32-bit microcontroller processor chip of ST company. ST's product portfolio contains a comprehensive range of microcontrollers, from robust, low-cost 8-bit MCUs up to 32-bit ARM-based Cortex®-M0 and M0+, Cortex®-M3, Cortex®-M4 Flash microcontrollers with a great choice of peripherals. ST has also extended this range to include an ultra-low-power MCU platform.

In addition, there are the following Features

1. Automotive grade monitoring & balancing IC with separate power supply for increased reliability
2. Voltages measurements for load, charger & battery pack
3. Bi-directional current monitoring
4. SOC based on coulomb counting
5. With humidity sensor and circuit board temperature monitoring.
6. Charger detection circuit
7. Integrated precharge circuit
8. The power button, USB-C, UART, I2C & isolated CAN bus interface
9. On board High-Efficiency 3.3V regulator powered from the main battery pack
10. High current capacity automotive grade screw connectors for main power connections
11. Buzzer & status LED
12. Aluminum alloy shell for better heat dissipation
13. Automotive grade design, automotive grade locking connector.
14. Compatible with MAXKGO-BMS-TOOL and ENNOID-BMS-TOOL.

Thanks for your patience, see you in the next blog.